REPEATER/SPLITTER
ARINC - 708 /  453   
 UP TO 4 CHANNELS 
IP available

 

  REPEATER BOARD SPECS.

  • UP TO 4 ARINC 708 CHANNELS
  • Transformer & direct coupling
  •  Internal Bus terminators
  • Humidity up to 95%
  • Board dimension:  4”x3”
  • Voltage Input 5 – VDC
    OPTIONAL VOLTAGE INPUT 28 VDC  
  • Low Power
    • 0.5W p/channel (50% duty cycle)
    • 20 mA Standby

 Temperature -40°C to +85°C

 Bus Terminators -  
     1 - Internal  Resistor terminators
     2-  Direc Coupling
     3-  Transformer coupling 



 REPEATER Features

  • Automatic signal input recognition
  • .Intelligent signal reconstruction
  • Typical delay time 500 nsec.
  • RF protection
  • Lock Connectors
  • Multiple Output  channels
  • Voltage Input 5 - VDC
    Optional Voltage Input 28 VDC

 

 

BMC ARINC 708 REPEATER - SPLITTER is an intelligent device with a fast and low power FPGA capable of reconstructing and boosting bi-directional signals on ARINC 708 coaxial cables.
Alternately, the unit can be configured as a splitter. Note that the information coming from a single input can be retransmitted to a different output cables. The Repeater board includes RF protections

The BMC repeater board is an efficient solution for long connections between devices. The unit automatically recognizes incoming information and retransmits without any delay.  

 

BMC ARINC 708  \ 453 Splitter

Using this format, the repeater transmits to a common “input” and data is retransmitted through three “outputs”.  Each cable is bi-directional so whenever one of the two “outputs” receives data it retransmits to the common “input”. The system constantly tracks signals coming from the three connectors.  If the two “outputs” transmit data the first output cached by the intelligent processor is going to be retransmitted to the common “input”.

 

 

Options

The BMC Repeater/Splitter is available with the following options:

1-     Multiple Input/output channels.

2-    Bus resistor terminator.

3-    Repeaters with or without a box.

4-    Repeaters with or without a 28 vdc power input.

5-    Customize PCB shape to meet customer requirements.

6-    Customize box to meet customer requirements

 

 




 Environmental specs

Temperature (Operating and Non-Operating)    

  Low Temperature MIL-STD-810E,502.3

  High Temperature MIL-STD-810E,501.3,

 Procedure 1

Humidity (Operating and Non-Operating)-

 Method 507.3, Procedure III of

 MIL-STD-810E, at a relative

 humidity of more than 90%.

Vibration Method 514.4 of MIL-STD-810E,

& Shock Procedure I Table 514.4-AII.

Bounce Loose Cargo - MIL-STD-810E, Method 514.4, Procedure III.

Shock Crash Safety  MIL-STD-810E, Method

514, Procedure V. The crash

conditions are as follows:

Pulse shape: half sin.

Pulse duration: 100msec ± 10%.

nx= +/-20g

ny= +/-16g

nz= +20g/-10g

Altitude MIL-STD-810E,Method 500.3

 Procedures I and II, at 18,000 feet

 for operation and 40,000 feet for

 transportation.  The Pressure change

 rate 3000 feet/min

Solar Radiation MIL-STD-810E,

Method 505.3 Procedure I

for 24 hours

Immersion MIL-STD-810E, Method 512.3,

Procedure I.

Rain- MIL-STD-810E, Method 503,

Procedure II.

Salt Fog -- MIL-STD-810E, Method 509.3,

Procedure I.

Sand and Dust -MIL-STD-810E,

Method 510.3, Procedure I.

Gunfire test for helicopter installation

MIL-STD-810E , method 519.4,

Procedure I.

Accelerations MIL-STD-810E, Method

513.4, Procedure II.

nx = +/- 1 g

ny = +/- 1 g            

nz = + 3.5 g /- 1 g

EMI/EMC MIL-STD-461D Army Ground

 

 


   Tel 631-256-5903   • Fax 516-997-2129 

 email:   REPEATER708@bmccorp.com

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